ECM provides fast curing high Tg conductive adhesive for CIGS modules

Engineered Conductive Materials (ECM) has developed a new fast curing conductive adhesive CA-100 for stringing and bussing next-generation CIGS solar modules. This material formulation is optimized for improved conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.

Next generation CIGS thin-film modules are challenges to compete with conventional c-Si technologies on both cost and performance. Shorter cycle-times coupled to improved yields and throughput, are required.
Solution

CA-100 is designed for thermal cycling and damp heat stability on molybdenum and other substrates used in the CIGS manufacturing process. The high Tg of CA-100 is suitable for manufacturing semi-rigid glass backed modules and is not designed for flexible modules utilizing reel-to-reel manufacturing. The material can be partially cured for 60 to 90 seconds, providing enough ‘green strength’ to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. CA-100 has optimized rheology for dispensing, improved damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.